Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
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Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
Universal BGA reballing stencil offers four different pitch options for precise soldering, ensuring versatility and accuracy in BGA IC chip repair.
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
зүйлийн дугаар: 228106567

Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel

зүйлийн дугаар: 228106567

MNT 49717

Price Details

Excluding Shipping & Custom charges ( Shipping and custom charges will be calculated on checkout )

*All items will import from Их Британи

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Их Британи UK дэлгүүрээс импортолсон
Яг одоо захиалаад ойрын хугацаанд хүлээн аваарай Пүрэв гараг, 8 дугаар сар 06
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Universal BGA reballing stencil offers four different pitch options for precise soldering, ensuring versatility and accuracy in BGA IC chip repair.
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What Stands Out

Compact Design
This reballing stencil's compact size facilitates easy storage and portability, making it ideal for repair technicians who require efficiency without sacrificing functionality during mobile device repairs.
High-Quality Material
Crafted from durable stainless steel, this stencil ensures long-lasting use and precision, providing technicians with reliable tools that withstand repeated use for thorough and accurate component repairs.
Universal Compatibility
Designed for various phone IC chips, this stencil provides versatility in repairs, addressing a wide range of user needs and ensuring compatibility with most popular device models on the market.

Бүтээгдэхүүний дэлгэрэнгүй мэдээлэл

Shop Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel online at a best price in Mongolia. B0GZVVW343
Item Weight1 lbs (450 grams)

Who Should Buy?

Suitable For
  • Mobile Repair Technicians

    Ideal for technicians specializing in mobile repairs, needing precise stencil tools for effective BGA reballing tasks.

  • DIY Electronics Enthusiasts

    Great for hobbyists looking to perform advanced repairs on smartphones, enhancing their skills with professional tools.

  • Small Repair Shops

    Perfect for small repair shops wanting compact and efficient reballing solutions to improve workflow and service quality.

Not Suitable For
  • Mass Production Facilities

    Not suitable for high-volume production environments requiring automation and large-scale reballing equipment.

  • Amateur Hobbyists

    Not recommended for beginners who may struggle with the precision required for effective BGA reballing without experience.

  • General Consumer Use

    Not for everyday consumers as it requires technical skills beyond basic user capabilities for effective application.

БАРААНЫ ТАЙЛБАР

Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel

Асуулга байна уу? Бидэнтэй чатлаарай

Хэрэглэгчийн асуулт ба хариултууд

  • Асуулт: What pitch options does the stencil offer?

    Хариулт: The stencil offers four pitch options: 0.3mm, 0.35mm, 0.375mm, and 0.4mm.
  • Асуулт: Is the stencil easy to transport?

    Хариулт: Yes, the compact and elegant design makes it portable and easy to use.
  • Асуулт: What materials is the stencil made from?

    Хариулт: The stencil is made from premium stainless steel, ensuring durability and longevity.

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Customer Reviews & Ratings

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MNT 49717

Яг одоо захиалаад ойрын хугацаанд хүлээн аваарай Пүрэв гараг, 8 дугаар сар 06

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Онцлог & Давуу талууд

  • Four pitch options for versatile and accurate soldering.
  • Fast and precise tin implantation without displacement.
  • Elegant, compact, and portable design for easy use.
  • Compatible with a variety of common IC chips.
  • Crafted from durable stainless steel for long-term reliability.
  • Ideal for efficient BGA IC chip repair.

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